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1. general description the 74aup2g125 provides the dual non-inverting buffer/line driver with 3-state output. the 3-state output is controlled by the output enable input (n oe). a high level at pin n oe causes the output to assume a high-impedance off-state. this device has the input-disable feature, which allows ?oating input signals. the inputs are disabled when the output enable input n oe) is high. schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 0.8 v to 3.6 v. this device ensures a very low static and dynamic power consumption across the entire v cc range from 0.8 v to 3.6 v. this device is fully speci?ed for partial power-down applications using i off . the i off circuitry disables the output, preventing a damaging back?ow current through the device when it is powered down. 2. features n wide supply voltage range from 0.8 v to 3.6 v n high noise immunity n complies with jedec standards: u jesd8-12 (0.8 v to 1.3 v) u jesd8-11 (0.9 v to 1.65 v) u jesd8-7 (1.2 v to 1.95 v) u jesd8-5 (1.8 v to 2.7 v) u jesd8-b (2.7 v to 3.6 v) n esd protection: u hbm jesd22-a114f class 3a exceeds 5000 v u mm jesd22-a115-a exceeds 200 v u cdm jesd22-c101d exceeds 1000 v n low static power consumption; i cc = 0.9 m a (maximum) n latch-up performance exceeds 100 ma per jesd78b class ii n inputs accept voltages up to 3.6 v n low noise overshoot and undershoot < 10 % of v cc n input-disable feature allows ?oating input conditions n i off circuitry provides partial power-down mode operation n multiple package options n speci?ed from - 40 cto+85 c and - 40 c to +125 c 74aup2g125 low-power dual buffer/line driver; 3-state rev. 06 27 november 2009 product data sheet
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 2 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74aup2g125dc - 40 c to +125 c vssop8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 74aup2g125gt - 40 c to +125 c xson8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 1.95 0.5 mm sot833-1 74AUP2G125GF - 40 c to +125 c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1 0.5 mm sot1089 74aup2g125gd - 40 c to +125 c xson8u plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 2 0.5 mm sot996-2 74aup2g125gm - 40 c to +125 c xqfn8u plastic extremely thin quad ?at package; no leads; 8 terminals; utlp based; body 1.6 1.6 0.5 mm sot902-1 table 2. marking codes type number marking code [1] 74aup2g125dc p25 74aup2g125gt p25 74AUP2G125GF am 74aup2g125gd p25 74aup2g125gm p25 fig 1. logic symbol fig 2. iec logic symbol 001aah931 1a 1y 1oe 2a 2y 2oe 001aah932 1 2 en1 en2
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 3 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 6. pinning information 6.1 pinning fig 3. logic diagram (one gate) mna227 noe na ny fig 4. pin con?guration sot765-1 (vssop8) fig 5. pin con?guration sot833-1 and sot1089 (xson8) 74aup2g125 1oe v cc 1a 2oe 2y 1y gnd 2a 001aae973 1 2 3 4 6 5 8 7 74aup2g125 1y 2oe v cc 2a 2y 1a 1oe gnd 001aae974 36 27 18 45 transparent top view fig 6. pin con?guration sot996-2 (xson8u) fig 7. pin con?guration sot902-1 (xqfn8u) 001aaj471 74aup2g125 transparent top view 8 7 6 5 1 2 3 4 1oe 1a 2y gnd v cc 2oe 1y 2a 001aae975 1a 1y 1oe v cc 2y 2oe gnd 2a transparent top view 3 6 4 1 5 8 7 2 terminal 1 index area 74aup2g125
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 4 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. 8. limiting values [1] the minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for vssop8 packages: above 110 c the value of p tot derates linearly with 8.0 mw/k. for xson8, xson8u and xqfn8u packages: above 118 c the value of p tot derates linearly with 7.8 mw/k. table 3. pin description symbol pin description sot765-1, sot833-1, sot996-2 and sot1089 sot902-1 1 oe, 2 oe 1, 7 7, 1 output enable input (active low) 1a, 2a 2, 5 6, 3 data input gnd 4 4 ground (0 v) 1y, 2y 6, 3 2, 5 data output v cc 8 8 supply voltage table 4. function table [1] input output n oe na ny lll lhh hxz table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +4.6 v i ik input clamping current v i <0v - 50 - ma v i input voltage [1] - 0.5 +4.6 v i ok output clamping current v o <0v - 50 - ma v o output voltage active mode and power-down mode [1] - 0.5 +4.6 v i o output current v o =0 vtov cc - 20 ma i cc supply current - 50 ma i gnd ground current - 50 - ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [2] - 250 mw
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 5 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 9. recommended operating conditions 10. static characteristics table 6. operating conditions symbol parameter conditions min max unit v cc supply voltage 0.8 3.6 v v i input voltage 0 3.6 v v o output voltage active mode 0 v cc v power-down mode; v cc = 0 v 0 3.6 v t amb ambient temperature - 40 +125 c d t/ d v input transition rise and fall rate v cc = 0.8 v to 3.6 v 0 200 ns/v table 7. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb = 25 c v ih high-level input voltage v cc = 0.8 v 0.70 v cc -- v v cc = 0.9 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 v cc v v cc = 0.9 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = - 20 m a; v cc = 0.8 v to 3.6 v v cc - 0.1 - - v i o = - 1.1 ma; v cc = 1.1 v 0.75 v cc -- v i o = - 1.7 ma; v cc = 1.4 v 1.11 - - v i o = - 1.9 ma; v cc = 1.65 v 1.32 - - v i o = - 2.3 ma; v cc = 2.3 v 2.05 - - v i o = - 3.1 ma; v cc = 2.3 v 1.9 - - v i o = - 2.7 ma; v cc = 3.0 v 2.72 - - v i o = - 4.0 ma; v cc = 3.0 v 2.6 - - v v ol low-level output voltage v i = v ih or v il i o = 20 m a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.31 v i o = 1.9 ma; v cc = 1.65 v - - 0.31 v i o = 2.3 ma; v cc = 2.3 v - - 0.31 v i o = 3.1 ma; v cc = 2.3 v - - 0.44 v i o = 2.7 ma; v cc = 3.0 v - - 0.31 v i o = 4.0 ma; v cc = 3.0 v - - 0.44 v
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 6 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.1 m a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- 0.1 m a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.2 m a d i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- 0.2 m a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v - - 0.5 m a d i cc additional supply current data input; v i =v cc - 0.6 v; i o =0a; v cc = 3.3 v [1] --40 m a n oe input; v i =v cc - 0.6 v; i o =0a; v cc = 3.3 v [1] - - 110 m a all inputs; v i = gnd to 3.6 v; n oe = gnd; v cc = 0.8 v to 3.6 v [2] --1 m a c i input capacitance v i = gnd or v cc ; v cc = 0 v to 3.6 v - 0.8 - pf c o output capacitance output enabled; v o = gnd; v cc = 0 v - 1.4 - pf output disabled; v o = gnd or v cc ; v cc = 0 v to 3.6 v - 1.3 - pf t amb = - 40 c to +85 c v ih high-level input voltage v cc = 0.8 v 0.70 v cc -- v v cc = 0.9 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 v cc v v cc = 0.9 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = - 20 m a; v cc = 0.8 v to 3.6 v v cc - 0.1 - - v i o = - 1.1 ma; v cc = 1.1 v 0.7 v cc -- v i o = - 1.7 ma; v cc = 1.4 v 1.03 - - v i o = - 1.9 ma; v cc = 1.65 v 1.30 - - v i o = - 2.3 ma; v cc = 2.3 v 1.97 - - v i o = - 3.1 ma; v cc = 2.3 v 1.85 - - v i o = - 2.7 ma; v cc = 3.0 v 2.67 - - v i o = - 4.0 ma; v cc = 3.0 v 2.55 - - v table 7. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 7 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state v ol low-level output voltage v i = v ih or v il i o = 20 m a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.37 v i o = 1.9 ma; v cc = 1.65 v - - 0.35 v i o = 2.3 ma; v cc = 2.3 v - - 0.33 v i o = 3.1 ma; v cc = 2.3 v - - 0.45 v i o = 2.7 ma; v cc = 3.0 v - - 0.33 v i o = 4.0 ma; v cc = 3.0 v - - 0.45 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.5 m a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- 0.5 m a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.5 m a d i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- 0.6 m a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v - - 0.9 m a d i cc additional supply current data input; v i =v cc - 0.6 v; i o =0a; v cc = 3.3 v [1] --50 m a n oe input; v i =v cc - 0.6 v; i o =0a; v cc = 3.3 v [1] - - 120 m a all inputs; v i = gnd to 3.6 v; n oe = gnd; v cc = 0.8 v to 3.6 v [2] --1 m a t amb = - 40 c to +125 c v ih high-level input voltage v cc = 0.8 v 0.75 v cc -- v v cc = 0.9 v to 1.95 v 0.70 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.25 v cc v v cc = 0.9 v to 1.95 v - - 0.30 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = - 20 m a; v cc = 0.8 v to 3.6 v v cc - 0.11 - - v i o = - 1.1 ma; v cc = 1.1 v 0.6 v cc -- v i o = - 1.7 ma; v cc = 1.4 v 0.93 - - v i o = - 1.9 ma; v cc = 1.65 v 1.17 - - v i o = - 2.3 ma; v cc = 2.3 v 1.77 - - v i o = - 3.1 ma; v cc = 2.3 v 1.67 - - v i o = - 2.7 ma; v cc = 3.0 v 2.40 - - v i o = - 4.0 ma; v cc = 3.0 v 2.30 - - v table 7. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 8 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state [1] one input at v cc - 0.6 v, other input at v cc or gnd. [2] to show i cc remains very low when the input-disable feature is enabled. 11. dynamic characteristics v ol low-level output voltage v i = v ih or v il i o = 20 m a; v cc = 0.8 v to 3.6 v - - 0.11 v i o = 1.1 ma; v cc = 1.1 v - - 0.33 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.41 v i o = 1.9 ma; v cc = 1.65 v - - 0.39 v i o = 2.3 ma; v cc = 2.3 v - - 0.36 v i o = 3.1 ma; v cc = 2.3 v - - 0.50 v i o = 2.7 ma; v cc = 3.0 v - - 0.36 v i o = 4.0 ma; v cc = 3.0 v - - 0.50 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.75 m a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- 0.75 m a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.75 m a d i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- 0.75 m a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v - - 1.4 m a d i cc additional supply current data input; v i =v cc - 0.6 v; i o =0a; v cc = 3.3 v [1] --75 m a n oe input; v i =v cc - 0.6 v; i o =0a; v cc = 3.3 v [1] - - 180 m a all inputs; v i = gnd to 3.6 v; n oe = gnd; v cc = 0.8 v to 3.6 v [2] --1 m a table 7. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit table 8. dynamic characteristics voltages are referenced to gnd (groun d = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 c - 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) c l = 5 pf t pd propagation delay na to ny; see figure 8 [2] v cc = 0.8 v - 20.6 - - - - ns v cc = 1.1 v to 1.3 v 2.8 5.5 10.5 2.5 11.7 12.9 ns v cc = 1.4 v to 1.6 v 2.2 3.9 6.1 2.0 7.3 8.1 ns v cc = 1.65 v to 1.95 v 1.9 3.2 4.8 1.7 6.1 6.7 ns v cc = 2.3 v to 2.7 v 1.6 2.6 3.6 1.4 4.3 4.9 ns v cc = 3.0 v to 3.6 v 1.4 2.4 3.1 1.2 3.9 4.4 ns
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 9 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state t en enable time n oe to ny; see figure 9 [3] v cc = 0.8 v - 69.9 - - - - ns v cc = 1.1 v to 1.3 v 3.1 6.1 11.8 2.9 13.9 15.4 ns v cc = 1.4 v to 1.6 v 2.5 4.2 6.6 2.3 7.7 8.3 ns v cc = 1.65 v to 1.95 v 2.1 3.4 5.1 2.0 6.2 6.8 ns v cc = 2.3 v to 2.7 v 1.8 2.6 3.7 1.7 4.5 5.0 ns v cc = 3.0 v to 3.6 v 1.7 2.4 3.1 1.7 3.5 3.9 ns t dis disable time n oe to ny; see figure 9 [4] v cc = 0.8 v - 14.3 - - - - ns v cc = 1.1 v to 1.3 v 2.7 4.3 6.5 2.7 7.3 8.2 ns v cc = 1.4 v to 1.6 v 2.1 3.2 4.4 2.1 5.1 5.7 ns v cc = 1.65 v to 1.95 v 2.0 3.0 4.3 2.0 5.0 5.7 ns v cc = 2.3 v to 2.7 v 1.4 2.2 2.9 1.4 3.3 4.1 ns v cc = 3.0 v to 3.6 v 1.7 2.5 3.2 1.7 3.4 3.9 ns c l = 10 pf t pd propagation delay na to ny; see figure 8 [2] v cc = 0.8 v - 24.0 - - - - ns v cc = 1.1 v to 1.3 v 3.2 6.4 12.3 3.0 13.8 15.2 ns v cc = 1.4 v to 1.6 v 2.1 4.5 7.3 1.9 8.5 9.4 ns v cc = 1.65 v to 1.95 v 1.9 3.8 5.5 1.7 6.8 7.6 ns v cc = 2.3 v to 2.7 v 2.1 3.2 4.2 1.6 5.3 5.9 ns v cc = 3.0 v to 3.6 v 1.8 3.0 3.8 1.6 4.6 5.2 ns t en enable time n oe to ny; see figure 9 [3] v cc = 0.8 v - 73.7 - - - - ns v cc = 1.1 v to 1.3 v 3.6 6.9 13.5 3.4 15.8 17.5 ns v cc = 1.4 v to 1.6 v 2.3 4.8 7.7 2.2 8.6 9.4 ns v cc = 1.65 v to 1.95 v 2.0 3.9 5.8 1.9 6.8 7.4 ns v cc = 2.3 v to 2.7 v 1.8 3.2 4.3 1.7 5.3 5.9 ns v cc = 3.0 v to 3.6 v 1.7 3.0 3.9 1.7 4.3 4.8 ns t dis disable time n oe to ny; see figure 9 [4] v cc = 0.8 v - 32.7 - - - - ns v cc = 1.1 v to 1.3 v 3.4 5.4 7.9 3.4 8.8 9.9 ns v cc = 1.4 v to 1.6 v 2.2 4.1 5.5 2.2 6.2 7.1 ns v cc = 1.65 v to 1.95 v 2.2 4.2 5.6 1.9 6.3 7.1 ns v cc = 2.3 v to 2.7 v 1.7 3.0 3.8 1.7 4.5 5.1 ns v cc = 3.0 v to 3.6 v 2.1 3.8 4.8 1.7 5.0 5.6 ns table 8. dynamic characteristics continued voltages are referenced to gnd (groun d = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 c - 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c)
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 10 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state c l = 15 pf t pd propagation delay na to ny; see figure 8 [2] v cc = 0.8 v - 27.4 - - - - ns v cc = 1.1 v to 1.3 v 3.6 7.2 14.1 3.3 15.8 17.5 ns v cc = 1.4 v to 1.6 v 3.0 5.1 8.1 2.5 9.8 10.9 ns v cc = 1.65 v to 1.95 v 2.2 4.3 6.3 2.0 7.9 8.8 ns v cc = 2.3 v to 2.7 v 2.0 3.7 4.9 1.8 6.0 6.7 ns v cc = 3.0 v to 3.6 v 2.0 3.5 4.4 1.8 5.4 6.1 ns t en enable time n oe to ny; see figure 9 [3] v cc = 0.8 v - 77.5 - - - - ns v cc = 1.1 v to 1.3 v 4.0 7.7 15.2 3.7 17.6 19.6 ns v cc = 1.4 v to 1.6 v 3.0 5.3 8.4 2.5 9.8 10.7 ns v cc = 1.65 v to 1.95 v 2.3 4.4 6.5 2.1 7.7 8.5 ns v cc = 2.3 v to 2.7 v 2.1 3.6 5.0 2.0 6.1 6.8 ns v cc = 3.0 v to 3.6 v 2.0 3.5 4.4 1.9 4.9 5.5 ns t dis disable time n oe to ny; see figure 9 [4] v cc = 0.8 v - 60.8 - - - - ns v cc = 1.1 v to 1.3 v 4.3 6.5 9.2 3.7 10.3 11.6 ns v cc = 1.4 v to 1.6 v 3.0 5.0 6.5 2.5 7.4 8.4 ns v cc = 1.65 v to 1.95 v 3.0 5.3 7.0 2.1 7.4 8.9 ns v cc = 2.3 v to 2.7 v 2.1 3.8 4.9 2.0 5.1 6.4 ns v cc = 3.0 v to 3.6 v 2.9 5.0 6.2 1.9 6.6 7.4 ns c l = 30 pf t pd propagation delay na to ny; see figure 8 [2] v cc = 0.8 v - 37.4 - - - - ns v cc = 1.1 v to 1.3 v 4.8 9.5 19.0 4.4 21.6 24.0 ns v cc = 1.4 v to 1.6 v 4.0 6.7 10.8 3.0 13.0 14.5 ns v cc = 1.65 v to 1.95 v 2.9 5.6 8.4 2.6 10.3 11.5 ns v cc = 2.3 v to 2.7 v 2.7 4.8 6.3 2.5 7.8 8.7 ns v cc = 3.0 v to 3.6 v 2.7 4.6 5.8 2.5 7.5 8.3 ns t en enable time n oe to ny; see figure 9 [3] v cc = 0.8 v - 88.9 - - - - ns v cc = 1.1 v to 1.3 v 5.2 9.9 19.8 4.8 22.8 25.3 ns v cc = 1.4 v to 1.6 v 4.0 6.8 10.8 3.1 12.6 14.1 ns v cc = 1.65 v to 1.95 v 3.0 5.6 8.5 2.8 10.2 11.3 ns v cc = 2.3 v to 2.7 v 2.7 4.8 6.5 2.6 7.8 8.8 ns v cc = 3.0 v to 3.6 v 2.7 4.6 6.0 2.6 6.9 7.7 ns table 8. dynamic characteristics continued voltages are referenced to gnd (groun d = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 c - 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c)
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 11 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state [1] all typical values are measured at nominal v cc . [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzh and t pzl . [4] t dis is the same as t phz and t plz . [5] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; s (c l v cc 2 f o ) = sum of the outputs. t dis disable time n oe to ny; see figure 9 [4] v cc = 0.8 v - 49.9 - - - - ns v cc = 1.1 v to 1.3 v 6.0 9.9 13.3 4.8 14.8 16.5 ns v cc = 1.4 v to 1.6 v 4.4 7.7 9.6 3.1 10.8 12.1 ns v cc = 1.65 v to 1.95 v 5.1 8.7 11.1 2.8 12.4 13.8 ns v cc = 2.3 v to 2.7 v 3.6 6.2 7.6 2.6 8.6 9.6 ns v cc = 3.0 v to 3.6 v 5.2 8.7 10.5 2.6 10.8 13.1 ns c l = 5 pf, 10 pf, 15 pf and 30 pf c pd power dissipation capacitance output enabled; f i = 1 mhz; v i = gnd to v cc [5] v cc = 0.8 v - 2.7 - - - - pf v cc = 1.1 v to 1.3 v - 2.8 - - - - pf v cc = 1.4 v to 1.6 v - 2.9 - - - - pf v cc = 1.65 v to 1.95 v - 3.0 - - - - pf v cc = 2.3 v to 2.7 v - 3.6 - - - - pf v cc = 3.0 v to 3.6 v - 4.2 - - - - pf table 8. dynamic characteristics continued voltages are referenced to gnd (groun d = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 c - 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c)
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 12 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 12. waveforms measurement points are given in t ab le 9 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 8. the data input (na) to output (ny) propagation delays mna230 t phl t plh v m v m na input ny output gnd v i v oh v ol table 9. measurement points supply voltage output input v cc v m v m v i t r = t f 0.8 v to 3.6 v 0.5 v cc 0.5 v cc v cc 3.0 ns measurement points are given in t ab le 10 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 9. enable and disable times mna362 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v i v ol v oh v cc v m gnd gnd t pzl t pzh v m v m table 10. measurement points supply voltage input output v cc v m v m v x v y 0.8 v to 1.6 v 0.5 v cc 0.5 v cc v ol + 0.1 v v oh - 0.1 v 1.65 v to 2.7 v 0.5 v cc 0.5 v cc v ol + 0.15 v v oh - 0.15 v 3.0 v to 3.6 v 0.5 v cc 0.5 v cc v ol + 0.3 v v oh - 0.3 v
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 13 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state [1] for measuring enable and disable times r l = 5 k w . for measuring propagation delays, set-up and hold times, and pulse width, r l = 1 m w . test data is given in t ab le 11 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 10. load circuitry for switching times 001aac521 dut r t v i v o v ext v cc r l 5 k w c l g table 11. test data supply voltage load v ext v cc c l r l [1] t plh , t phl t pzh , t phz t pzl , t plz 0.8 v to 3.6 v 5 pf, 10 pf, 15 pf and 30 pf 5 k w or 1 m w open gnd 2 v cc
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 14 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 13. package outline fig 11. package outline sot765-1 (vssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (2) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 0 0.13 0.1 0.2 0.4 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 q 0.21 0.19 sot765-1 mo-187 02-06-07 w m b p d z e 0.12 14 8 5 q a 2 a 1 q l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale vssop8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 1 pin 1 index
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 15 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state fig 12. package outline sot833-1 (xson8) terminal 1 index area references outline version european projection issue date iec jedec jeita sot833-1 - - - mo-252 - - - sot833-1 07-11-14 07-12-07 dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 2.0 1.9 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 8 2 7 3 6 4 5 8 (2) 4 (2) a
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 16 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state fig 13. package outline sot1089 (xson8) references outline version european projection issue date iec jedec jeita sot1089 mo-252 sot1089_po 09-04-10 09-10-22 unit mm max nom min 0.5 0.04 1.40 1.35 1.30 1.05 1.00 0.95 0.55 0.35 0.20 0.15 0.12 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm sot1089 a 1 bb 1 0.40 0.35 0.32 0.35 0.30 0.27 deee 1 l 0 0.5 1 mm scale terminal 1 index area e d detail x a a 1 b b 1 l e 1 e terminal 1 index area 1 4 8 5 (4 ) (2) (8 ) (2) x
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 17 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state fig 14. package outline sot996-2 (xson8u) references outline version european projection issue date iec jedec jeita sot996-2 - - - - - - sot996-2 07-12-18 07-12-21 unit a max mm 0.5 0.05 0.00 0.35 0.15 3.1 2.9 0.5 1.5 0.5 0.3 0.6 0.4 0.1 0.05 a 1 dimensions (mm are the original dimensions) xson8u: plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 x 2 x 0.5 mm 0 1 2 mm scale b d 2.1 1.9 e e e 1 l l 1 0.15 0.05 l 2 v w 0.05 y y 1 0.1 c y c y 1 x b 14 85 e 1 e a c b v m c w m l 2 l 1 l terminal 1 index area b a d e detail x a a 1
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 18 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state fig 15. package outline sot902-1 (xqfn8u) references outline version european projection issue date iec jedec jeita sot902-1 mo-255 - - - - - - sot902-1 05-11-25 07-11-14 unit a max mm 0.5 a 1 0.25 0.15 0.05 0.00 1.65 1.55 0.35 0.25 0.15 0.05 dimensions (mm are the original dimensions) xqfn8u: plastic extremely thin quad flat package; no leads; 8 terminals; utlp based; body 1.6 x 1.6 x 0.5 mm b dl e 1 1.65 1.55 e e l 1 v 0.1 0.55 0.5 w 0.05 y 0.05 0.05 y 1 0 1 2 mm scale x c y c y 1 terminal 1 index area terminal 1 index area b a d e detail x a a 1 b 8 7 6 5 e 1 e 1 e e a c b ? v m c ? w m 4 1 2 3 l l 1 metal area not for soldering
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 19 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 14. abbreviations 15. revision history table 12. abbreviations acronym description cdm charged device model cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model table 13. revision history document id release date data sheet status change notice supersedes 74aup2g125_6 20091127 product data sheet - 74aup2g125_5 modi?cations: ? added type number 74AUP2G125GF (xson8 package) 74aup2g125_5 20090202 product data sheet - 74aup2g125_4 74aup2g125_4 20090122 product data sheet - 74aup2g125_3 74aup2g125_3 20080409 product data sheet - 74aup2g125_2 74aup2g125_2 20070419 product data sheet - 74aup2g125_1 74aup2g125_1 20061017 product data sheet - -
74aup2g125_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 27 november 2009 20 of 21 nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74aup2g125 low-power dual buffer/line driver; 3-state ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 27 november 2009 document identifier: 74aup2g125_6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 20 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 17 contact information. . . . . . . . . . . . . . . . . . . . . 20 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

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